Zoomic Eagle Vision Solution

We provide Total Machine Vision Solutions for semiconductor IC inspection. Our products include Lead, Mark & Package defects inspection systems for SOP, SOT, SC70, MLP, QFP, BGA and etc.

We also provide customized solutions for both semiconductor and non-semiconductor inspection such as pharmaceutical, food industry and automotive industry with sub-pixel accuracy measurement systems and high-speed on-the-fly vision systems. Our solutions are guaranteed to be const-effective, innovative and user friendly.

Products

Mark Inspection
>Criterias:

Missing
Illegible
Incomplete
Incorrect
Mis-Alignment
Double
Angle
Reverse
Bow
No Mark
Blurred
Scratch / Broken

>Rapid Inspection Time :

< 10 ms

>Caters for both ink/laser markings
>Minimum detectable char defect size: 8 x 5 pixels

Software Features

Simultaneous multiple camera inspection in single software
Support infinity number of station under single software
GR&R and SPC ready
Configurable access controls
Software process audit logs
User friendly window based graphical interface
High Accuracy: 7.5 µm [2D & 3D lead vision]
7.5 µm - 12.5m [Mark & Package vision]

Advantages

Provide high speed inspection up to 20ms/unit
Color surface inspection
Support matrix inspection
Optional combinations vision system (Lead, Mark and Package)
Others:

::5 sided lead view using single camera technology
::Multiple mark templates inspection
::Optional extra products :

OCR Inspection
BGA Inspection
Barcode Inspection (including 2D-Barcode)

Color Inspection

The EagleVision system can support grayscale and color inspection.

Multiple Station

The EagleVision System can support multiple camera inspection running at the same time.

Key Benefits

No shape constraint
Support color and monochrome inspection
Highly interactive ROI learning process
Easy to operate requires minimum training

Round ROI

The EagleVision system able to inspect object in round shape.

Freehand ROI

The EagleVision system able to inspect object in any kind of shape.